Product Overview
Xilinx XC3090-70 FPGA, Gold Ceramic 175-Pin Package on a Breakout PCB
Condition
Used, pulled from legacy equipment, and sold as the complete assembly. The gold lid is clearly marked XILINX, XC3090 -70, PG175C, X07902M, X9226ME, with fine surface scratches across the gold and a dark pin-1 corner mark on the purple ceramic body. The device sits on an olive-green FR4 daughterboard carrying gold-pin headers along the top and right edges, several DIP switch banks, two upright metal-can components at the top edge, a gold-plated eight-pin socket at the lower right, and a hand-soldered blue jumper wire near the mode-pin silkscreen. Board silkscreen reads CCLK, DIN, D/P, M0, M2, RESET, EVENT, PTAGH, PTAGL, LSP, NORM and GMCO. Against the PartsMine ruler the board measures roughly 6.9 cm wide by 12.5 cm tall, and the ceramic package is about 4.5 cm square. No corrosion, cracked ceramic or bent header pins are visible. We have not published a bench test on this piece, so treat it as an untested used pull and verify configuration in your own fixture. Two available.
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Product Overview
The Xilinx XC3090 is a field-programmable gate array from the XC3000 family, the SRAM-based programmable logic generation that loads its configuration at power-up rather than holding it in fuses. This one carries the -70 speed grade and lives in a 175-pin ceramic pin grid array with a gold lid, the durable hermetic style Xilinx used before plastic packaging took over the volume market. It is not a loose chip: it arrives already mounted on its original breakout daughterboard. The silkscreen labels CCLK, DIN, D/P, M0 and M2 sit beside bare plated vias near the package, while the gold-pin headers are labeled LSP, NORM, GMCO, PTAGH, PTAGL, EVENT and RESET and the DIP switch banks are labeled HPD, LPD, L.P.C., H.P.C. and G.C. Listing designation is PP175C, and the marking on the lid itself reads PG175C, so match the exact string your own documentation calls for before you order. Lot markings X07902M and X9226ME are readable in the second photo if you need to decode production data.
Key Features
- Manufacturer: Xilinx
- Device: XC3090, XC3000 family field-programmable gate array
- Speed grade: -70
- Package: 175-pin ceramic pin grid array with gold lid (listing designation PP175C, lid marked PG175C)
- Lid markings: XILINX, XC3090 -70, PG175C, X07902M, X9226ME
- Supplied mounted on a breakout PCB daughterboard, not as a loose device
- Daughterboard carries gold-pin headers, DIP switch banks and a gold-plated eight-pin socket
- Board approximately 6.9 cm by 12.5 cm; ceramic package approximately 4.5 cm square, measured against the ruler
- Silkscreen: CCLK, DIN, D/P, M0 and M2 beside bare vias near the package; headers labeled LSP, NORM, GMCO, PTAGH, PTAGL, EVENT, RESET; DIP banks labeled HPD, LPD, L.P.C., H.P.C., G.C.
- Condition: used, pulled from legacy equipment, untested
- Quantity available: 2
Applications
- Maintenance technician keeping a 1990s instrument or industrial controller running when the original XC3090 board is the failed item
- Hardware engineer who wants a 175-pin PGA already mounted on a daughterboard with gold-pin headers and DIP switch banks for bench work
- Restorer or teaching lab documenting early SRAM-based programmable logic in its original gold ceramic form
- Collector of gold-lidded ceramic ICs who would rather have the device on its daughterboard than loose in a tube
Frequently Asked Questions
What exactly do the markings on the gold lid say?
Reading down the lid: XILINX, then XC3090 -70, then PG175C, then X07902M, then X9226ME. The listing calls the package PP175C and the lid reads PG175C, so compare both strings against your own board or documentation before ordering.
Can the FPGA be removed from the breakout board?
We sell it as the assembly and have not attempted removal. No socket is visible under the package in the photos, so plan on desoldering a 175-pin PGA if you need the bare device.
Has this been tested or configured?
No test result is recorded for this unit. It is offered as a used pull in clean physical condition, so verify power-up and configuration loading in your own fixture before committing it to a repair.
What else is on the daughterboard?
Gold-pin headers along the top and right edges, several DIP switch banks including eight-position units flanking the FPGA, two upright metal-can components at the top edge, a gold-plated eight-pin socket at the lower right, and one blue jumper wire soldered near the mode-pin area. The board is supplied exactly as photographed.
Why buy one or two of these here instead of a bulk lot somewhere else?
PartsMine sells the exact quantity you need. There are two of these on the shelf and you can buy a single board for one repair or one prototype instead of taking a forced lot of ten or fifty. Shipping is $8 flat rate and free over $28, so a small order usually costs less in total than a minimum-quantity purchase elsewhere, and it goes out same or next business day from Idaho.
A hand-soldered blue jumper still crosses this board near the mode pins, left there by whoever needed this gold-lidded XC3090 to behave a certain way. Whether it goes back into a legacy chassis or sits under glass on a shelf, the next decision on it is yours.
