Product Overview
Xilinx XC3090-100 PP175C FPGA, Still Mounted on Its LEMO-Equipped Breakout Test Card
Condition
Used, pulled from legacy nuclear instrumentation modules, and clean under the camera. The FPGA is a black square package with a molded pin-grid dimple pattern on top, marked XILINX, XC3090-100, PP175C, F40364A, and a lot line reading BKI9541. It sits on a light green card carrying two LEMO coaxial jacks silkscreened MSP and LSP, nine small DIP switch packages, three gold-pin header strips, an eight-position machined socket at the lower right, one axial resistor, and a short blue jumper wire looped between two turret posts just left of the M-labeled mode pads. Silkscreen labels including NORM, GMG0, PTAGH, PTAGL, EVENT, RESET, HPD, LPD, PCLK, DIN, and D/P are all legible in the photos. Against the ruler the card measures approximately 7 cm across at its widest. No cracked package, no scorching, and no bent header pins are visible. No electrical test result is claimed for this board, so treat the photos as the spec.
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Product Overview
The XC3090-100 PP175C is a field-programmable gate array from Xilinx's early XC3000 generation, supplied here in the PP175 175-pin PGA-style package and already mounted on the breakout test card it came out of. XC3000 family parts are SRAM based, meaning configuration is loaded at power up rather than burned into the die, which is why the card carries a jumper wire at the M-labeled mode pads and bare pads silkscreened DIN and D/P. The speed grade is the -100 shown in the part number. What arrives is one populated card: the FPGA, the two LEMO coax jacks, the DIP switch banks used to set the module's parameters, and the gold headers that were the board's interface to whatever chassis it lived in. Marked F40364A on the fourth line and BKI9541 on the fifth, this is a specific photographed piece rather than a generic catalog number.
Key Features
- Manufacturer: Xilinx
- Device: XC3090-100 PP175C, speed grade -100
- Type: field-programmable gate array, XC3000 generation
- Package: PP175, 175-pin PGA-style
- Additional package markings: F40364A, BKI9541
- Mounted on a breakout test card with two LEMO coaxial jacks marked MSP and LSP
- Card also carries nine small DIP switch packages, three gold-pin header strips, an eight-position machined socket, and a blue jumper wire on two turret posts beside the M-labeled mode pads
- Card measures approximately 7 cm across at its widest against the ruler
- Condition: used, pulled from legacy nuclear instrumentation modules
- Quantity available: one
Applications
- Instrumentation technician keeping a legacy counting or pulse-processing module alive who needs the exact XC3090-100 in the PP175 footprint rather than a modern substitute
- Vintage programmable logic collector who wants an early Xilinx PGA device with its original host card and markings intact
- Hardware engineer harvesting the card itself for its LEMO jacks, gold headers, DIP switch banks, and machined socket
- Instructor or lab building a teaching artifact for how SRAM-based FPGAs were configured before on-board flash was standard
Frequently Asked Questions
What exactly is printed on the FPGA?
Five lines, all readable in the close-up photo: XILINX, XC3090-100, PP175C, F40364A, and BKI9541. We are quoting the package, not interpreting it, so decode the lot line against Xilinx documentation if the date matters to your build.
Has the FPGA been programmed or tested?
No test or configuration result is claimed here. The device came out of legacy nuclear instrumentation modules and is offered on the strength of the photos and the markings. Verify function on your own bench before committing it to a repair.
Can the FPGA be removed from the card?
Not confirmed. The photos are top views and do not show whether the package is socketed or soldered through the board, so plan for either outcome before you buy it for the chip alone.
What do the DIP switches and the LEMO jacks do?
Not confirmed for this specific board. The silkscreen labels MSP, LSP, NORM, GMG0, PTAGH, PTAGL, EVENT, RESET, HPD, LPD, PCLK, DIN, and D/P are legible in the photos, but no schematic or documentation comes with the card. Read the labels off the images and trace the rest yourself.
It is a used pull, so what am I actually getting?
Exactly the card in these two photographs and nothing else: one XC3090-100 PP175C on its breakout test card, pulled from legacy nuclear instrumentation, sold as-is with no functional claim, no documentation, and no mating cables. The switches are in whatever position the last operator left them. You are taking on the testing, and in exchange you get a specific photographed unit with every marking visible up front instead of a mystery part out of a bin. Shipping is $8 flat rate, free once your order passes $28, and orders leave our Idaho warehouse the same or next business day.
Somebody built this little card around a 175-pin Xilinx, wired two LEMO jacks to it, and set nine banks of switches to count something worth counting. That job is finished, and the next one is yours to write into it.
