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5.2 x 8.9 cm Solderable Breadboard PCB Prototype Board Black, New

PartsMine

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$5.14
SKU:
P26040
Condition:
New
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Product Overview

Half-Size Solderable Perfboard with 2.54mm Pitch and Power Rails

Condition

New. Double-sided prototyping circuit card with intact black solder mask and gold-plated through-holes. Center channel silkscreen marked Breadboard. Sold each.

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Product Overview

Designed to match standard half-size solderless breadboards, this 5.2 x 8.9 cm prototype PCB provides a direct transfer from temporary jumper-wire mockups to permanent, soldered hardware. The layout provides 30 numbered rows of five-hole tie points across columns A through J, flanked along both long edges by dual continuous power rails.

Key Features

  • 5.2 x 8.9 cm outer dimensions matching half-size breadboard footprints
  • Standard 2.54 mm (0.1 in) hole spacing for DIP ICs, headers, and discrete components
  • 30 numbered rows divided into columns A-E and F-J across a center channel
  • Dual continuous positive and negative power distribution rails on both long sides
  • Gold-plated through-holes with durable black solder mask finish
  • Two center and four corner mounting holes for mechanical fastening

Applications

  • Transferring solderless breadboard microcontroller and sensor circuits into permanent hardware
  • Prototyping custom audio effects circuits, guitar pedals, and synthesizer modules
  • Assembling dedicated point-to-point test fixtures and breakout cards for bench testing

Frequently Asked Questions

Does this board have the same trace connections as a solderless breadboard?

Yes. The five holes in each numbered row (A-E and F-J) are electrically connected, and the power rails run continuously along both outer edges, directly mirroring standard solderless breadboard routing.

What is the pin spacing?

The through-holes are arranged on a standard 2.54 mm (0.1 in) grid, accepting standard DIP integrated circuits, pin headers, and through-hole passives.

Will a standard 0.3-inch DIP integrated circuit straddle the center channel?

Yes. The center divider spacing matches standard 0.3-inch DIP IC socket widths, leaving columns A-E on one side of the chip and F-J on the other for breakout connections.

Moving a circuit from push-in breadboard to soldered fiberglass is the exact moment an experiment turns into a tool. Route your traces, flow the solder, and put it in an enclosure that never comes unclipped.

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